View PTN3332_4658626.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

PTN3332 high speed differential line receiver rev. 01 07 january 2004 product data 1. description the PTN3332 is a differential line receiver that implements the electrical characteristics of low-voltage differential signaling (lvds). this device meets or exceeds the requirements of the ansi tia/eia-644 standard . lvds is used to achieve higher data rates on commonly used media. lvds overcomes the limitations of achievable slew rates and emi restrictions of previous differential signaling techniques. the PTN3332 operates at a 3.3 volt supply level. any of the four differential receivers provides a valid logical output state with a 100 mv differential input voltage within the input common-mode voltage range. the input common-mode voltage range allows 1 volt of ground potential difference between two lvds nodes. the intended application of this device is for point-to-point baseband transmission rates over a controlled impedance media of approximately 100 w . the maximum rates and distance of data transfer are dependent upon the attenuation characteristics of the media selected and the noise coupling to the environment. the PTN3332 is designed to function over the full industrial temperature range of - 40 cto+85 c. 2. features n meets or exceeds the requirements of ansi tia/eia-644 standard n designed for signaling rates of up to 400 mbps n differential input thresholds of 100 mv n power dissipation of 60 mw typical at 200 mhz n typical propagation delay of 2.6 ns n low voltage ttl (lvttl) logic output levels n pin compatible with am26ls32 and sn65lvds32 n open-circuit fail safe. 3. applications n low voltage, low emi, high speed differential signal receiver n point-to-point high speed data transmission n high performance switches and routers.
philips semiconductors PTN3332 high speed differential line receiver product data rev. 01 07 january 2004 2 of 16 9397 750 08341 ? koninklijke philips electronics n.v. 2004. all rights reserved. 4. pinning information 4.1 pinning 4.2 pin description fig 1. tssop16 pin con?guration. fig 2. so16 pin con?guration. PTN3332dh 002aaa026 1 2 3 4 5 6 7 8 1b 1a 1y g 2y 2a 2b gnd v cc 4b 4a 4y g 3y 3a 3b 16 15 14 13 12 11 10 9 PTN3332d 002aaa027 1 2 3 4 5 6 7 8 1b 1a 1y g 2y 2a 2b gnd v cc 4b 4a 4y g 3y 3a 3b 16 15 14 13 12 11 10 9 table 1: pin description symbol pin description 1b 1 lvds inverting input 1a 2 lvds non-inverting input 1y 3 lvttl output g 4 enable (active-high) 2y 5 lvttl output 2a 6 lvds non-inverting input 2b 7 lvds inverting input gnd 8 ground 3b 9 lvds inverting input 3a 10 lvds non-inverting input 3y 11 lvttl output g 12 enable (active-low) 4y 13 lvttl output 4a 14 lvds non-inverting input 4b 15 lvds inverting input v cc 16 supply
philips semiconductors PTN3332 high speed differential line receiver product data rev. 01 07 january 2004 3 of 16 9397 750 08341 ? koninklijke philips electronics n.v. 2004. all rights reserved. 5. ordering information 6. functional diagram division 7. functional description 7.1 function table [1] h = high level; l = low level; x = irrelevant; z = high impedance; ? = indeterminate state. table 2: ordering information type number package name description version PTN3332dh tssop16 plastic thin shrink small outline package; 16 leads; body width 4.4 mm sot403-1 PTN3332d so16 plastic small outline package; 16 leads; body width 3.9 mm sot109-1 fig 3. functional diagram. 002aaa028 PTN3332 1y g g lvds 4 12 3 1a 2 1b 1 2y lvds 5 2a 6 2b 7 3y lvds 11 3a 10 3b 9 4y lvds 13 4a 14 4b 15 table 3: function table division differential input enables output a, b g g y v id 3 100 mv h x h xl h - 100 mv < v id < 100 mv h x ? xl ? v id - 100 mv h x l xl l xlhz open h x l xl l
philips semiconductors PTN3332 high speed differential line receiver product data rev. 01 07 january 2004 4 of 16 9397 750 08341 ? koninklijke philips electronics n.v. 2004. all rights reserved. 8. limiting values [1] values beyond absolute maximum ratings can cause the device to be prematurely damaged. absolute maximum ratings are stress ratings only and functional device operation is not implied. 9. recommended operating conditions table 4: limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter min max unit v cc supply voltage - 0.5 4.0 v v i input voltage (enables and outputs) - 0.5 v cc + 0.5 v input voltage (a or b inputs) - 0.5 4.0 v t amb operating ambient temperature range - 40 +85 c t j operating junction temperature - 40 +150 c t stg storage temperature range - 65 +150 c esd >2 - kv table 5: recommended operating conditions symbol parameter min nom max unit v cc supply voltage 3 3.3 3.6 v v ih high-level input voltage 2 -- v v il low-level input voltage -- 0.8 v v id magnitude of differential input voltage 0.1 - 0.6 v v ic common-mode input voltage v id /2 - 2.4 - v id /2 v t amb operating temperature range - 40 - +85 c
philips semiconductors PTN3332 high speed differential line receiver product data rev. 01 07 january 2004 5 of 16 9397 750 08341 ? koninklijke philips electronics n.v. 2004. all rights reserved. 10. static characteristics [1] all typical values are at t amb =25 c and v cc = 3.3 v. table 6: dc electrical characteristics over recommended operating conditions, unless otherwise noted. symbol parameter conditions min typ [1] max unit v rr+ positive differential input voltage threshold see figure 4 and ta b l e 8 . -- 100 mv v rr - negative differential input voltage threshold - 100 -- mv v oh high-level output voltage i oh = - 8 ma 2.4 -- v i oh = - 4 ma 2.8 -- v v ol low-level output voltage i ol =8ma -- 0.4 v i cc supply current enabled, no load - 10 18 ma disabled - 0.25 0.5 ma i i input current (a or b inputs) v i =0v - 2 - 10 - 20 m a v i = 2.4 v - 1.2 - 3 -m a i i(off) power-off input current (a or b inputs) v cc =0v; v i = 3.6 v - 6 20 m a i ih high-level input current (g or g inputs) v ih =2v - - 10 m a i il low-level input current (g or g inputs) v il = 0.8 v - - 10 m a i oz high-impedance output current v o = 0 v or v cc - 10 - 10 m a
philips semiconductors PTN3332 high speed differential line receiver product data rev. 01 07 january 2004 6 of 16 9397 750 08341 ? koninklijke philips electronics n.v. 2004. all rights reserved. 11. dynamic characteristics [1] all typical values are at t amb =25 c, and v cc = 3.3 v. [2] t sk(o) is the skew between speci?ed outputs of a single device with all driving inputs connected together and the outputs switching in the same direction while driving identical speci?ed loads. [3] t sk(p-p) is the magnitude of the difference in propagation delay times between any speci?ed terminals of two devices when both devices operate with the same supply voltages, same temperature, and have identical packages and test circuits. table 7: ac electrical characteristics over recommended operating conditions, unless otherwise noted. symbol parameter conditions min typ [1] max unit t plh propagation delay, low-to-high level output c l =10pf see figure 5 . 1.3 2.6 6 ns t phl propagation delay, high-to-low level output 1.3 2.5 6 ns t r output rise time (20 to 80%) - 0.6 - ns t f output fall time (80 to 20%) - 0.7 - ns t sk(p) pulse skew (t phl - t plh ) -- 0.4 ns t sk(o) channel-to-channel output skew [2] - 0.1 0.3 ns t sk(p-p) part-to-part skew [3] -- 1ns t pzh propagation delay, high-impedance to high-level output see figure 6 . - 812ns t pzl propagation delay, high-impedance to low-level output - 312ns t phz propagation delay, high-level to high-impedance output - 6.5 12 ns t plz propagation delay, low-level to high-impedance output - 5.5 12 ns
philips semiconductors PTN3332 high speed differential line receiver product data rev. 01 07 january 2004 7 of 16 9397 750 08341 ? koninklijke philips electronics n.v. 2004. all rights reserved. 12. test ?gures fig 4. voltage de?nitions. table 8: receiver minimum and maximum input threshold test voltages applied voltages resulting differential input voltage resulting common-mode input voltage v ia v ib v id v ic 1.25 v 1.15 v 100 mv 1.2 v 1.15 v 1.25 v - 100 mv 1.2 v 2.4 v 2.3 v 100 mv 2.35 v 2.3 v 2.4 v - 100 mv 2.35 v 0.1 v 0 v 100 mv 0.05 v 0 v 0.1 v - 100 mv 0.05 v 1.5 v 0.9 v 600 mv 1.2 v 0.9 v 1.5 v - 600 mv 1.2 v 2.4 v 1.8 v 600 mv 2.1 v 1.8 v 2.4 v - 600 mv 2.1 v 0.6 v 0 v 600 mv 0.3 v 0 v 0.6 v - 600 mv 0.3 v a b y (v ia + v ib ) 2 v ic v ia v ib v id v o 002aaa029
philips semiconductors PTN3332 high speed differential line receiver product data rev. 01 07 january 2004 8 of 16 9397 750 08341 ? koninklijke philips electronics n.v. 2004. all rights reserved. fig 5. timing test circuit and waveforms. a b y v ia v ib v id v o 002aaa030 c l = 10 pf v ia v ib 1.4 v 1.0 v v id 0.4 v C0.4 v 0 v v oh 1.4 v v ol t phl t plh t f t r 80% 20% 80% 20% v o
philips semiconductors PTN3332 high speed differential line receiver product data rev. 01 07 january 2004 9 of 16 9397 750 08341 ? koninklijke philips electronics n.v. 2004. all rights reserved. fig 6. enable/disable time test circuit and waveforms. t pzh v o a b 002aaa031 c l 10 pf 1.2 v g g v test a g 2.5 v 1.0 v 2.0 v 1.4 v 0.8 v 2.0 v 1.4 v 0.8 v g v test t pzl t plz t pzl t plz v ol v ol + 0.5 v 1.4 v 2.5 v y v test a g 0 v 1.4 v 2.0 v 1.4 v 0.8 v 2.0 v 1.4 v 0.8 v g t phz t pzh t phz 0 v v oh C 0.5 v 1.4 v v oh y r 500 w
philips semiconductors PTN3332 high speed differential line receiver product data rev. 01 07 january 2004 10 of 16 9397 750 08341 ? koninklijke philips electronics n.v. 2004. all rights reserved. 13. package outline fig 7. tssop16 package outline (sot403-1). unit a 1 a 2 a 3 b p cd (1) e (2) (1) eh e ll p qz y w v q references outline version european projection issue date iec jedec jeita mm 0.15 0.05 0.95 0.80 0.30 0.19 0.2 0.1 5.1 4.9 4.5 4.3 0.65 6.6 6.2 0.4 0.3 0.40 0.06 8 0 o o 0.13 0.1 0.2 1 dimensions (mm are the original dimensions) notes 1. plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. plastic interlead protrusions of 0.25 mm maximum per side are not included. 0.75 0.50 sot403-1 mo-153 99-12-27 03-02-18 w m b p d z e 0.25 18 16 9 q a a 1 a 2 l p q detail x l (a ) 3 h e e c v m a x a y 0 2.5 5 mm scale tssop16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm sot403-1 a max. 1.1 pin 1 index
philips semiconductors PTN3332 high speed differential line receiver product data rev. 01 07 january 2004 11 of 16 9397 750 08341 ? koninklijke philips electronics n.v. 2004. all rights reserved. fig 8. so16 package outline (sot109-1). x w m q a a 1 a 2 b p d h e l p q detail x e z e c l v m a (a ) 3 a 8 9 1 16 y pin 1 index unit a max. a 1 a 2 a 3 b p cd (1) e (1) (1) eh e ll p qz y w v q references outline version european projection issue date iec jedec jeita mm inches 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 10.0 9.8 4.0 3.8 1.27 6.2 5.8 0.7 0.6 0.7 0.3 8 0 o o 0.25 0.1 dimensions (inch dimensions are derived from the original mm dimensions) note 1. plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 1.0 0.4 sot109-1 99-12-27 03-02-19 076e07 ms-012 0.069 0.010 0.004 0.057 0.049 0.01 0.019 0.014 0.0100 0.0075 0.39 0.38 0.16 0.15 0.05 1.05 0.041 0.244 0.228 0.028 0.020 0.028 0.012 0.01 0.25 0.01 0.004 0.039 0.016 0 2.5 5 mm scale so16: plastic small outline package; 16 leads; body width 3.9 mm sot109-1
philips semiconductors PTN3332 high speed differential line receiver product data rev. 01 07 january 2004 12 of 16 9397 750 08341 ? koninklijke philips electronics n.v. 2004. all rights reserved. 14. soldering 14.1 introduction to soldering surface mount packages this text gives a very brief insight to a complex technology. a more in-depth account of soldering ics can be found in our data handbook ic26; integrated circuit packages (document order number 9398 652 90011). there is no soldering method that is ideal for all ic packages. wave soldering can still be used for certain surface mount ics, but it is not suitable for ?ne pitch smds. in these situations re?ow soldering is recommended. in these situations re?ow soldering is recommended. 14.2 re?ow soldering re?ow soldering requires solder paste (a suspension of ?ne solder particles, ?ux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. several methods exist for re?owing; for example, convection or convection/infrared heating in a conveyor type oven. throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. typical re?ow peak temperatures range from 215 to 270 c depending on solder paste material. the top-surface temperature of the packages should preferably be kept: ? below 225 c (snpb process) or below 245 c (pb-free process) C for all bga, htsson..t and ssop..t packages C for packages with a thickness 3 2.5 mm C for packages with a thickness < 2.5 mm and a volume 3 350 mm 3 so called thick/large packages. ? below 240 c (snpb process) or below 260 c (pb-free process) for packages with a thickness < 2.5 mm and a volume < 350 mm 3 so called small/thin packages. moisture sensitivity precautions, as indicated on packing, must be respected at all times. 14.3 wave soldering conventional single wave soldering is not recommended for surface mount devices (smds) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. to overcome these problems the double-wave soldering method was speci?cally developed. if wave soldering is used the following conditions must be observed for optimal results: ? use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave.
philips semiconductors PTN3332 high speed differential line receiver product data rev. 01 07 january 2004 13 of 16 9397 750 08341 ? koninklijke philips electronics n.v. 2004. all rights reserved. ? for packages with leads on two sides and a pitch (e): C larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; C smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves at the downstream end. ? for packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves downstream and at the side corners. during placement and before soldering, the package must be ?xed with a droplet of adhesive. the adhesive can be applied by screen printing, pin transfer or syringe dispensing. the package can be soldered after the adhesive is cured. typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 c or 265 c, depending on solder material applied, snpb or pb-free respectively. a mildly-activated ?ux will eliminate the need for removal of corrosive residues in most applications. 14.4 manual soldering fix the component by ?rst soldering two diagonally-opposite end leads. use a low voltage (24 v or less) soldering iron applied to the ?at part of the lead. contact time must be limited to 10 seconds at up to 300 c. when using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 c. 14.5 package related soldering information [1] for more detailed information on the bga packages refer to the (lf)bga application note (an01026); order a copy from your philips semiconductors sales of?ce. [2] all surface mount (smd) packages are moisture sensitive. depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). for details, refer to the drypack information in the data handbook ic26; integrated circuit packages; section: packing methods . table 9: suitability of surface mount ic packages for wave and re?ow soldering methods package [1] soldering method wave re?ow [2] bga, htsson..t [3] , lbga, lfbga, sqfp, ssop..t [3] , tfbga, uson, vfbga not suitable suitable dhvqfn, hbcc, hbga, hlqfp, hso, hsop, hsqfp, hsson, htqfp, htssop, hvqfn, hvson, sms not suitable [4] suitable plcc [5] , so, soj suitable suitable lqfp, qfp, tqfp not recommended [5][6] suitable ssop, tssop, vso, vssop not recommended [7] suitable cwqccn..l [8] , pmfp [9] , wqccn..l [8] not suitable not suitable
philips semiconductors PTN3332 high speed differential line receiver product data rev. 01 07 january 2004 14 of 16 9397 750 08341 ? koninklijke philips electronics n.v. 2004. all rights reserved. [3] these transparent plastic packages are extremely sensitive to re?ow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared re?ow soldering with peak temperature exceeding 217 c 10 c measured in the atmosphere of the re?ow oven. the package body peak temperature must be kept as low as possible. [4] these packages are not suitable for wave soldering. on versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. on versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. [5] if wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. the package footprint must incorporate solder thieves downstream and at the side corners. [6] wave soldering is suitable for lqfp, qfp and tqfp packages with a pitch (e) larger than 0.8 mm; it is de?nitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. [7] wave soldering is suitable for ssop and tssop packages with a pitch (e) equal to or larger than 0.65 mm; it is de?nitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. [8] image sensor packages in principle should not be soldered. they are mounted in sockets or delivered pre-mounted on ?ex foil. however, the image sensor package can be mounted by the client on a ?ex foil by using a hot bar soldering process. the appropriate soldering pro?le can be provided on request. [9] hot bar soldering or manual soldering is suitable for pmfp packages. 15. revision history table 10: revision history rev date cpcn description 01 20040107 - product data (9397 750 08341). ecn 853-2443 a14996 dated 15 december 2003.
9397 750 08341 philips semiconductors PTN3332 high speed differential line receiver ? koninklijke philips electronics n.v. 2004. all rights reserved. product data rev. 01 07 january 2004 15 of 16 contact information for additional information, please visit http://www.semiconductors.philips.com . for sales of?ce addresses, send e-mail to: sales.addresses@www.semiconductors.philips.com . fax: +31 40 27 24825 16. data sheet status [1] please consult the most recently issued data sheet before initiating or completing a design. [2] the product status of the device(s) described in this data sheet may have changed since this data sheet was published. the l atest information is available on the internet at url http://www.semiconductors.philips.com. [3] for data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. 17. de?nitions short-form speci?cation the data in a short-form speci?cation is extracted from a full data sheet with the same type number and title. for detailed information see the relevant data sheet or data handbook. limiting values de?nition limiting values given are in accordance with the absolute maximum rating system (iec 60134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the speci?cation is not implied. exposure to limiting values for extended periods may affect device reliability. application information applications that are described herein for any of these products are for illustrative purposes only. philips semiconductors make no representation or warranty that such applications will be suitable for the speci?ed use without further testing or modi?cation. 18. disclaimers life support these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips semiconductors for any damages resulting from such application. right to make changes philips semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. when the product is in full production (status production), relevant changes will be communicated via a customer product/process change noti?cation (cpcn). philips semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise speci?ed. level data sheet status [1] product status [2][3] de?nition i objective data development this data sheet contains data from the objective speci?cation for product development. philips semiconductors reserves the right to change the speci?cation in any manner without notice. ii preliminary data quali?cation this data sheet contains data from the preliminary speci?cation. supplementary data will be published at a later date. philips semiconductors reserves the right to change the speci?cation without notice, in order to improve the design and supply the best possible product. iii product data production this data sheet contains data from the product speci?cation. philips semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. relevant changes will be communicated via a customer product/process change noti?cation (cpcn).
? koninklijke philips electronics n.v. 2004. printed in the u.s.a. all rights are reserved. reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. the information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. no liability will be accepted by the publisher for any consequence of its use. publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. date of release: 07 january 2004 document order number: 9397 750 08341 contents philips semiconductors PTN3332 high speed differential line receiver 1 description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 pinning information . . . . . . . . . . . . . . . . . . . . . . 2 4.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 4.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 ordering information . . . . . . . . . . . . . . . . . . . . . 3 6 functional diagram division . . . . . . . . . . . . . . . 3 7 functional description . . . . . . . . . . . . . . . . . . . 3 7.1 function table . . . . . . . . . . . . . . . . . . . . . . . . . . 3 8 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 9 recommended operating conditions. . . . . . . . 4 10 static characteristics. . . . . . . . . . . . . . . . . . . . . 5 11 dynamic characteristics . . . . . . . . . . . . . . . . . . 6 12 test ?gures. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 13 package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 14 soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 14.1 introduction to soldering surface mount packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 14.2 re?ow soldering . . . . . . . . . . . . . . . . . . . . . . . 12 14.3 wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 12 14.4 manual soldering . . . . . . . . . . . . . . . . . . . . . . 13 14.5 package related soldering information . . . . . . 13 15 revision history . . . . . . . . . . . . . . . . . . . . . . . . 14 16 data sheet status . . . . . . . . . . . . . . . . . . . . . . . 15 17 de?nitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 18 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

▲Up To Search▲

Price & Availability of PTN3332

	To Download PTN3332 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .